SPECIFICATIONS:
ELECTRICAL CHARACTERISTICS:
1)PATING:2A(PIN1/5) ,0.5A(PIN2/3/4)
2)CONTACT RESISTANCE:30mΩ max ,initial 40mΩ max
3)DIELECTRIC WITHSTANDING VOLTAGE:500V AC for one minute
4)INSULATION RESISTANCE:100mΩ min measured by 500VDC
MECHANICAL CHARACTERISTICS:
1)INSERTION FORCE:3.6 kgf max
2)WITHDRAWAL FORCE:0.8 kgf min
3)LIFE TEST:10000 cycles
OTHER GENERAL SPEC TO REFER 2UB1000-SERIES SPEC
TO CONFORM TO THE SINGATRON HSF SPEC
HALOGEN FREE PRODUCT IDENTIFICATION MARK
ON PRODUCT.
HALOGEN FREE PRODUCT IDENTIFICATION LABEL
ON PACKAGING
FOR REFLOW SOLDERING LEAD-FREE PROCESS
SOLDER HEAT RESISTANCE REFLOW SOLDERING 260℃ 10SECS
PLUG INTERFACE DIMENSIONS COMFORM TO USB2.0 SPEC